Esko Hosts Regional Innovation Days in June 2025 to Advance Packaging Industry Digitalization

Esko will continue its “Esko on Tour” roadshow in June 2025 with five regional Innovation Days across Germany and Austria. The events aim to explore the current state and future direction of packaging production, focusing on digitalization, automation, and process standardization.

Key topics include sustainability, cloud computing, artificial intelligence, third-party integration, centralized data storage, and process efficiency. Attendees will also learn how Esko’s latest solutions support packaging workflows and have the opportunity to network with industry peers.

The Innovation Days will take place from June 16 to 26 in Vienna, Friedrichshafen, Hamburg, Dortmund, and Heidelberg. Esko’s Regional Software Solutions Manager for the DACH region, Christopher Weber, emphasized the company’s role as a partner in digital transformation and highlighted the importance of dialogue with customers to align future strategies.

Weber also pointed to the growing importance of SaaS and cloud-based solutions, the potential of AI for workflow optimization, and the integration of production machines via IoT. Sustainability will be another major focus, including innovations like fixed color set (ECG) printing to reduce waste and setup times.

Events begin at 9:15 a.m. and end around 2:30 p.m. For details and registration, visit: https://go.esko.com/l/133071/2025-04-03/8yjvg1