May 23, 2018
Highcon Euclid IIIC for corrugated board causing a stir at FESPA
Appearing for the first time at FESPA in Berlin this week in Hall 5.2, Booth D-20, Highcon Systems is looking…
Flexible Packaging, Corrugated Packaging, Folding Carton, Labels
Appearing for the first time at FESPA in Berlin this week in Hall 5.2, Booth D-20, Highcon Systems is looking…
Following the recent launch of the Highcon Euclid IIIC digital cutting and creasing machine for corrugated board, Highcon and LxBxH…