ESU – Technology Forum

August 28, 2019 Off By Sebastian Reisig

Arden Software will be at the ESU Technology Forum (The European Diemaker Association) in Luxembourg from September 13 -14.

Held every two years, the theme of the 2019 event is Industry 4.0 and the Internet of Things.

We’ll be giving die-makers a glimpse into the future of packaging production, showcasing for the first time our new Die-shop Management Tool ahead of its eagerly anticipated release next year.

The new turn-key solution, designed specifically for die-makers, has been developed from a version of our powerful project management software WEBcnx.